Description
The foundation of the ASUS PRIME series is comprehensive control features. The PRIME B760 motherboard is equipped with flexible tools to customize every aspect of your system, allowing you to tune performance to your working style for maximum efficiency.
Intelligent Control.
ASUS Intelligent Control makes your PC smart. Beyond advanced settings and dynamic optimization of the most critical system aspects, it offers simplified smart options for beginners building PCs themselves, as well as more advanced features for experienced users.
Comprehensive energy efficiency.
The power-saving feature includes several settings that allow easy optimization of power consumption and maximum energy savings. You can enable CPU power limiting, dim Aura lighting, set a fan profile to power-saving mode, and also activate the power-saving plan built into Microsoft Windows.
Flexible air and liquid cooling control.
The ASUS Fan Xpert 2+ software provides complete control over fans and all-in-one (AiO) coolers. The automatic tuning mode intelligently configures all parameters with a single mouse click, regardless of whether the system is air or water cooled. There is also an Extreme Quiet mode that reduces case fan speeds to a minimum by default, making your system nearly silent during light workloads. Fans and AiO coolers can also be controlled via UEFI BIOS.
Precise digital power control.
The Digi+ Voltage Regulator Module (VRM) ensures real-time voltage drop monitoring, automatically switching frequency and energy efficiency settings. It also allows precise tuning of your processor for maximum stability and performance.
UEFI BIOS.
The renowned ASUS UEFI BIOS provides everything needed to configure, tune, and adjust your system. It offers intelligently simplified options for beginners building PCs themselves, as well as comprehensive features for experienced veterans.
M.2 heatsink.
The M.2 heatsink prevents throttling that may occur during prolonged data transfers on M.2 drives. The heatsink is secured with non-round screws, and these removable small screws help reduce the risk of dropping or losing them during heatsink removal.
VRM heatsinks and thermal pads.
VRM heatsinks and thermal pads improve heat dissipation from MOSFETs and chokes for better cooling.
ProCool connector.
Proprietary connectors strengthen the motherboard's connection to the power supply via 8-pin connectors that deliver 12-volt power directly to processors. Each connector features solid contacts capable of handling higher current than hollow connectors.
Six-layer PCB design.
Multiple layers of the printed circuit board optimize heat dissipation for critical components, providing more headroom for overclocking processors beyond standard speeds.
Stack Cool 3+.
2-ounce copper layers draw heat away from critical components, maintaining their optimal operating temperature and providing greater headroom for overclocking processors beyond rated speeds.
DDR4 support.
Enhanced trace design provides the latest Intel processors with expanded memory bandwidth access. ASUS OptiMem II technology carefully routes memory signal paths through different PCB layers to reduce spacing between them, while adding shielding zones that significantly reduce crosstalk.
ASUS OptiMem II.
Signal routing changes on the motherboard provide the latest processors with unrestricted memory bandwidth access. ASUS OptiMem II technology carefully routes memory signal paths through different PCB layers to reduce gaps, and adds shielding zones that significantly reduce crosstalk.