Description
H.D.T 3.0
Advanced heat conductor quickly dissipates heat from the processor.
High-performance H.D.T heat pipes
Four ultra-precisely balanced heat pipes help surpass the performance limits of a standard cooler.
Large heatsink surface area
Precisely assembled aluminum fins provide a thermal surface area of approximately 4950 cm², significantly larger than other coolers with 4 heat pipes.
Optimal cooling
Improve cooling efficiency with a powerful PWM fan, reducing speed under low loads and increasing it under high loads.
Metal mounting hardware for easy installation
Upgraded metal mounting kits support popular INTEL/AMD platforms.
Thermal paste
Thermal conductivity of included thermal paste: 12.8 W/(m·K).